Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same

A thermosetting resin composition for a semiconductor package comprising:

• a binder, a slurry filler and a curing accelerator,
• wherein the binder contains 20 to 30 wt % of a naphthalene epoxy resin, 25 to 73 wt % of a bismaleimide resin, and 5 to 7 wt % of a benzoxazine resin based on a total weight of the binder,
• wherein the thermosetting resin composition has a viscosity of 20 to 50 cps at a temperature of 20 to 35° C., wherein the thermosetting resin composition does not include a phenolic curing agent,
• wherein the bismaleimide resin includes 4,4′-bismaleimido-diphenylmethane or a mixture of a bismaleimide-triazine resin and 4,4′-bismaleimido-diphenylmethane, and
• wherein the curing accelerator is contained in an amount of 0.1 to 1 part by weight based on 100 parts by weight of the binder,
• wherein the slurry filler comprises an epoxy silane-modified silica dispersed in a solvent,
• wherein the benzoxazine resin is 3,3-bis(3-phenyl-2,4-dihydro-1,3-benzoxazin-6-yl)-2-benzofuran-1-one,
• wherein the slurry filler is contained at a content of 180 to 350 parts by weight based on 100 parts by weight of the binder, and wherein the epoxy silane-modified silica is contained at a content of 126 to 245 parts by weight based on 100 parts by weight of the binder.