Reactive end group containing polyimides and polyamic acids and photosensitive compositions thereof
AssigneePromerus, LLC
InventorsPramod Kandanarachchi, Cheryl Burns, Brian Knapp, Larry F Rhodes
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AssigneePromerus, LLC
InventorsPramod Kandanarachchi, Cheryl Burns, Brian Knapp, Larry F Rhodes
Estimating the term…
Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.
An end capped polyamic acid of the formula (IA) or an end capped polyimide of the formula (IB):
A composition comprising:
Dependencies are inferred from the claim text.