Curing composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

A multi-component epoxy resin system, comprising:

• an epoxy resin component (A) and a curing component,
• wherein the epoxy resin component (A) contains a curable epoxy resin, and the curing component contains at least one Mannich base and at least one amine which is reactive to epoxy groups,
• wherein the curable epoxy resin is based on one or more of bisphenol A or bisphenol F,
• wherein the at least one Mannich base is obtainable by reacting a phenolic compound selected from one or more of the group consisting of bisphenol A, bisphenol F, resorcinol, and phenol,
• with an aldehyde or an aldehyde precursor and an amine having at least two active hydrogen atoms in the molecule which are bonded to a nitrogen atom, and
• further comprising at least one salt (S) selected from salts of nitric acid, or salts of trifluoromethanesulfonic acid or combinations thereof contained in the epoxy resin component (A) and/or in the curing component, and
• wherein the at least one salt (S) comprises a cation other than ammonium or other than an ammonium cation substituted with an organic group, and
• wherein the at least one amine which is reactive to epoxy groups is selected from the group consisting of one or more selected from one or more of the group consisting of mXDA (m-xylylenediamine), IPDA (3-aminomethyl-3,5,5-trimethylcyclohexane), Dytek A (2-methylpentanediamine), TMD (1,6-diamino-2,2,4-trimethylhexane), N-EAP (N-ethylaminopiperazine), MCDA (methylcyclohexyl diamine), and 1,3-BAC (1,3-bis(aminomethyl)cyclohexane).