Polyimide-based composite carbon film with high thermal conductivity and preparation method therefor
AssigneeHangzhou Gaoxi Technology Co., Ltd.
InventorsChao Gao, Yan Guo
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AssigneeHangzhou Gaoxi Technology Co., Ltd.
InventorsChao Gao, Yan Guo
Estimating the term…
The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.
A preparation method for a polyimide-based composite carbon film with high thermal conductivity, comprising the following steps:
Dependencies are inferred from the claim text.