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US 11,535,509 B2Granted
Semiconductor package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Wei Liu, Huei-Siang Wong, Lu-Ming Lai
Life of this patent
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Abstract
A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.
Claims13
A semiconductor package structure, comprising:
- an electronic device having a first surface and an exposed region adjacent to the first surface;
- a dam disposed on the first surface and surrounding the exposed region of the electronic device;
- a filter structure disposed on the dam, wherein the filter structure comprises a first portion and a second portion surrounding the first portion, and
- an encapsulant encapsulating the first surface of the electronic device and surrounding the dam,
- wherein a surface of the dam is retracted from a top surface of the encapsulant, wherein the encapsulant has a substantially slant surface or a substantially curve surface, and wherein the encapsulant has an extension on the second portion of the filter structure.
2 more elements
A semiconductor package structure, comprising:
- an encapsulating member having an open cavity defined therein configured to expose an active surface of a semiconductor device;
- an filter structure exposed from the open cavity of the encapsulating member, the filter structure including:
- a first portion having a plurality of through holes formed therein arranged over the active surface of the semiconductor device, and
- a second portion formed around a periphery of the first portion;
- and
- a dam that surrounds the active surface of the semiconductor device and supports the second portion of the filter structure,
- wherein the encapsulating member contacts both a lateral surface of the dam and a lateral surface of the filter structure;
- and
- wherein a thickness of the encapsulating member reduces toward an outer edge portion thereof.
6 more elements
Dependencies are inferred from the claim text.