Molded product, metal-clad laminate, printed wiring board, and methods for their production

A method for producing a metal-clad laminate, comprising:

• applying, on the surface of a conductive metal foil, a liquid composition comprising a liquid medium and a material which comprises a melt-moldable tetrafluoroethylene type polymer comprising at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group, an amide group, an amino group, and an isocyanate group, and in which the content of components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass %;
• and
• removing the liquid medium and, at the same time, heating in an atmosphere consisting of nitrogen and optionally less than 10,000 ppm of oxygen and having a temperature of from Tm to (Tm+100)° C. wherein Tm is a melting point of the melt-moldable tetrafluoroethylene type polymer and is from 100 to 325° C., to let the melt-moldable tetrafluoroethylene type polymer be fusion-bonded to the conductive metal foil, to produce a metal-clad laminate having a conductive metal layer and a layer of a film in which the content of components other than the melt-moldable tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength region where the extinction coefficient becomes to be from 1.2 to 4.5, at from 200 to 380 nm.