Back to results
US 11,534,949 B2Granted
Injection molding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorYong Joo Park
Life of this patent
Estimating the term…
Abstract
Provided is an injection molding apparatus including a first mold and a second mold, an ejector plate provided on the first mold to reciprocate and configured to eject an injection molded object between the first mold and the second mold, and a sensor device having a moving sensor detachably attached to the ejector plate, and configured to detect a position of the ejector plate, wherein the sensor device is detachably attached to the first mold and the ejector plate by a magnetic force.
Claims11
An injection molding apparatus comprising:
- a first mold and a second mold;
- an ejector plate provided on the first mold to reciprocate and configured to eject an injection molded object between the first mold and the second mold, wherein the ejector plate moves between a standby position and a separation position to which the ejector plate is moved from the standby position to press the molded object to separate the molded object from the first mold;
- and
- a sensor device having including:
- a moving sensor detachably attached to the ejector plate, and configured to detect a position of the ejector plate,
- a fixed sensor located on the first mold to detect the moving sensor, and detachably attached to the ejector plate, wherein the moving sensor and the fixed sensor are provided to face each other in the standby position, and
- a mounting device allowing the fixed sensor and the moving sensor to be detachably attached to the first mold and the ejector plate, respectively, wherein the mounting device includes a mounting bracket fixedly disposed on the fixed sensor and the moving sensor.
4 more elements
Dependencies are inferred from the claim text.