Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device

A polishing apparatus, comprising:

• a measuring device configured to measure a film thickness of a film on a substrate;
• an arithmetic unit configured to identify a position and a height of a protrusion on the surface of the substrate based on the measurement of the film thickness and then select a recipe for polishing the surface of the substrate according to the position and height of the protrusion;
• a holder configured to hold a polishing pad for polishing the surface of the substrate;
• a plurality of pressing members configured to press a back surface side of the polishing pad being held by the holder and vary a polishing surface of the polishing pad that contact the surface of the substrate during polishing;
• and
• a driving unit configured to selectively move pressing members in a direction towards the surface of the substrate to press the back surface side of the polishing pad being held by the holder, wherein
• the driving unit is controlled according to the selected recipe to selectively move pressing members in the direction towards the surface of the substrate during the polishing of the surface of the substrate.

A substrate manufacturing method, comprising:

• bringing a polishing pad into contact with a surface of a substrate, wherein
• the polishing pad being held by a polishing apparatus, comprising:
• a holder configured to hold the polishing pad for polishing the surface of the substrate;
• a plurality of pressing members configured to press a back surface side of the polishing pad being held by the holder;
• and
• a driving unit configured to selectively move pressing members in a direction towards the surface of the substrate to press the back surface side of the polishing pad being held by the holder.