Laser processing apparatus

A laser processing apparatus comprising:

• a first chuck table for holding a workpiece on a holding surface thereof;
• a second chuck table for holding a workpiece on a holding surface thereof;
• an X-axis feed unit for moving the first chuck table and the second chuck table which are being arrayed in an X-axis direction;
• a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the first chuck table and the second chuck table to process the workpiece;
• and
• a pair of delivery areas arrayed in the X-axis direction on opposing sides of the laser beam applying unit, for delivering workpieces to and from the first chuck table and the second chuck table, wherein said X-axis feed unit moves the first chuck table and the second chuck table to and from the laser beam applying unit from a respective one of said delivery areas;
• wherein the laser beam applying unit includes:
• a laser oscillator for emitting the laser beam,
• a beam condenser for condensing the laser beam emitted from the laser oscillator, and
• a laser beam scanning unit disposed between the laser oscillator and the beam condenser, for displacing a position where the laser beam is applied to the holding surface of the one of the first chuck table and the second chuck table.