Substrate treatment apparatus

#The present disclosure relates to a substrate treatment apparatus.

#When manufacturing a semiconductor device or a display device, various processes such as photolithography, etching, ashing, ion implantation, thin film deposition, cleaning, and the like are performed. Here, the photolithography process includes a coating process, an exposure process, and a developing process. A photoresist is applied onto a substrate (that is, a coating process), a circuit pattern is exposed on the substrate formed with a photoresist film (that is, an exposure process), and an exposed area of the substrate is selectively developed (that is, a developing process).

#Various processes may be performed on one substrate, and the processes may be performed in separate chambers that are different from each other. Accordingly, the substrate may be moved between chambers for complete processing of the substrate.

#The above and other aspects and features of the present disclosure will become more apparent by describing exemplary embodiments thereof in detail with reference to the attached drawings, in which:

#FIG. 1 is a view illustrating a substrate treatment apparatus according to an exemplary embodiment of the present disclosure;

#FIG. 2 is a view illustrating a transparent rectangular substrate according to the exemplary embodiment of the present disclosure;

#Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The advantages and features of the present disclosure and methods for obtaining the same will be apparent from the following detailed description of the exemplary embodiments described with references to the following drawings. However, the present disclosure is not limited to the exemplary embodiments to be disclosed below and may be implemented in different various forms. The present exemplary embodiments are provided in order to fully explain the present disclosure and fully explain the scope of the present disclosure to those skilled in the art. The scope of the present disclosure is only defined by the appended claims. Like reference numerals refer to like elements throughout the specification.

#A case in which an element or layer is referred to as being “on” another element or layer includes a case in which the element is directly present on another element or layer and also includes a case in which the element is present on another element or layer with still another element or layer interposed therebetween. On the other hand, a case in which an element is referred to as being “directly on” another element includes a case in which still another element or layer is not interposed therebetween.

#Spatially relative terms such as “below,” “beneath,” “lower,” “above,” “upper,” and the like may be used to more easily describe a relationship between one element or components and another element or the other components as illustrated in the drawings. The spatially relative terms should be understood to have directions as illustrated in the drawings and have other directions when the elements are used or operated. For example, when an element illustrated in the drawing is turned upside down, the element which is illustrated to be present below or beneath another element may be present above another element. Accordingly, the term “below” used as an example includes both “below” and “above.” An element may be arranged in another direction, and thus, the spatially relative terms may be interpreted based on an arrangement direction.