Composition
AssigneeHewlett-Packard Development Company, L.P.
InventorsVladek Kasperchik, Mohammed S. Shaarawi, James McKinnell, Michael G. Monroe, Jason Hower
Life of this patent
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AssigneeHewlett-Packard Development Company, L.P.
InventorsVladek Kasperchik, Mohammed S. Shaarawi, James McKinnell, Michael G. Monroe, Jason Hower
Estimating the term…
An example of a composition includes a host metal present in an amount ranging from about 95.00 weight percent to about 99.99 weight percent, based on a total weight of the composition. A flow additive is present in an amount ranging from about 0.01 weight percent to about 5.00 weight percent, based on the total weight of the composition. The flow additive consists of a metal containing compound that is reducible to an elemental metal in a reducing environment at a reducing temperature less than or equal to a sintering temperature of the host metal. The elemental metal is capable of being incorporated into a bulk metal phase of the host metal in a final metal object. The composition is spreadable, having a Hausner Ratio less than 1.25.
A composition, comprising:
A three-dimensional (3D) printing kit, comprising:
A method for making a build material composition, comprising:
Dependencies are inferred from the claim text.