Linear object removal method, linear object removal device, and electronic/electric apparatus component scrap processing method

A method for processing electronic/electrical apparatus component scrap, the method comprising:

• arranging a plurality of filters in a vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction and a beam portion for supporting the plurality of rods at one ends of the plurality of rods, the other ends of the plurality of rods being free ends;
• placing a sheet-shaped pressing member comprising a sheet-shaped material, which presses the raw material placed on the filters, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side of the raw material, the sheet-shaped material configured to directly contact and press upon the wire-form objects;
• and
• feeding a raw material containing at least substrate scrap and wire scrap between the filters and the sheet-shaped material, and vibrating the filters to sieve out wire-form objects toward an under-sieve side of the vibrating sieve machine.

A device for removing wire-form objects, the device comprising:

• a vibrating sieve machine;
• a plurality of filters arranged in the vibrating sieve machine such that the filters are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters comprising a plurality of rods extending at distances in the feed direction and a beam portion for supporting the plurality of rods at one ends of the plurality of rods, the other ends of the plurality of rods being free ends;
• a sheet-shaped pressing member comprising a sheet-shaped material, which presses the raw material placed on the filters, the sheet-shaped material having a fixed end that is fixed to the vibrating sieve machine on the feed side of the raw material and the sheet-shaped material having a free end that is not fixed to the vibrating sieve machine on the discharge side of the raw material, the sheet-shaped material configured to directly contact and press upon the wire-form objects;
• and
• a vibrator for vibrating the filters to sieve out wire-form objects from a raw material containing at least the wire-form objects and plate-form objects toward an under-sieve side of the vibrating sieve machine.