Preparing method of monomolecular nano-thin film

#This application claims the benefit under 35 USC § 119(a) of Korean Patent Application Nos. 1 0-201 8-01 26765 filed on Oct. 23, 2018, and 10-2019-0122930 filed on Oct. 4, 2019, in the Korean Intellectual Property Office, the entire disclosures of which are incorporated herein by reference for all purposes.

#The present disclosure relates to a method of preparing a monomolecular nano-thin film.

#As human interface technology emphasizing durability, flexibility, and convenience continues to develop, the importance of development of flexible electronic devices and materials increases more and more. Flexible electrodes and materials required to drive the flexible electronic devices are also actively researched. Particularly, a demand for transparent electrodes and materials is continuously increasing in industrial fields such as touch-screen panel (TCP), solar cell, display, and the like. Thus, there is an urgent need to secure source technology to gain economic and technological superiority. Meanwhile, with the advancement of nanotechnology, nanomaterials which did not exist or could not be controlled have been synthesized. Among these nanomaterials, nanocrystals, carbon nanotubes, silicon nanowires, and metal nanowires have been applied to electronic devices. Particularly, the metal nanowires have high conductivity and are too small in size to be seen with naked eyes in the visible light region and thus are suitable for application to transparent electrodes.

#The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

#FIG. 1 is a flowchart of a method of preparing a nano-thin film according to an embodiment of the present disclosure.

#FIG. 2 is a photograph of a substrate on which a monomolecular nano-thin film is formed according to an example of the present disclosure.

#Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that the present disclosure may be readily implemented by those skilled in the art.

#However, it is to be noted that the present disclosure is not limited to the embodiments but can be embodied in various other ways. In drawings, parts irrelevant to the description are omitted for the simplicity of explanation, and like reference numerals denote like parts through the whole document. Through the whole document, the term “connected to” or “coupled to” that is used to designate a connection or coupling of one element to another element includes both a case that an element is “directly connected or coupled to” another element and a case that an element is “electronically connected or coupled to” another element via still another element.

#Through the whole document, the terms “on”, “above”, “on an upper end”, “below”, “under”, and “on a lower end” that are used to designate a position of one element with respect to another element include both a case that the one element is adjacent to the other element and a case that any other element exists between these two elements.