Implantable pulse generator headers including conductors having offset segments

A header for an implantable electronic device, the header comprising:

• a connector adapted to receive a lead end;
• and
• a conductor coupled to the connector, the conductor comprising a common segment and a forked terminal portion, the forked terminal portion including a first conductor segment and a second conductor segment that form a junction at the common segment, the second conductive segment offset from the first conductor segment,
• wherein:
• the first conductor segment is mechanically and electrically coupled to a first location of the connector by a first resistance weld joint, and
• the second conductor segment is mechanically and electrically coupled to a second location of the connector by a second resistance weld joint.

A method of manufacturing a header of an implantable electronic device, the header including a header connector assembly adapted to receive a proximal lead end of an implantable medical lead, the header connector assembly including a connector assembly including a connector, the method comprising:

• abutting a first conductor segment of a conductor against a first location of the connector,
• abutting a second conductor segment of the conductor against a second location of the connector, the second location offset from the first location;
• and
• resistance welding the first conductor segment to the connector at the first location and resistance welding the second conductor segment to the connector at the second location by passing a current between a first electrode in contact with the first conductor segment and a second electrode in contact with the second conductor segment such that the first conductor segment and the second conductor segment are welded to the connector at respective joints.