Optical module having externally-mounted magnetic ring and chip positioning angle and pressing block structure thereof

An optical module, comprising a metal front cover, a ceramic sleeve, a pressing block and a ceramic insertion core, the ceramic sleeve being disposed in the metal front cover and fixed by the pressing block, one end of the ceramic insertion core being disposed in the ceramic sleeve, another end of the ceramic insertion core being fixed in the pressing block, the pressing block including a pressing block body, the pressing block body being an integral structure, one end of the pressing block body being formed with an insertion core positioning hole for fixing the another end of the ceramic insertion core, another end of the pressing block body being formed with a chip accommodating hole for accommodating an isolator chip and a magnetic ring accommodating chamber for accommodating a magnetic ring, the chip accommodating hole coaxially communicating with the insertion core positioning hole, the magnetic ring accommodating chamber being arranged around the chip accommodating hole, the insertion core positioning hole being a round hole,

• wherein the pressing block body has two opposite end surfaces respectively defining the one end and the another end of the pressing block body, the two end surfaces each having a portion that is recessed, such that a first one of the recessed portions forms the insertion core positioning hole and a second one of recessed portions forms the chip accommodating hole and the first and second recessed portions are of different sizes and shapes having centers in alignment with each other in the axial direction, wherein the another end of the ceramic insertion core and the isolator chip are respectively received in the insertion core positioning hole and the chip accommodating hole that are defined by the first and second recessed portions such that the another end of the ceramic insertion core and the isolator chip are spaced from each other;
• wherein the second recessed portion that forms the chip accommodating hole comprises a surrounding wall that surrounds the chip accommodating hole, the surrounding wall having an inner circumferential surface and an outer circumferential surface opposite to the inner circumferential surface, wherein the inner circumferential surface circumferentially delimits an internal space of the surrounding wall that forms the chip accommodating hole in which the isolator chip is received and the outer circumferential surface defines, at least partly, the magnetic ring accommodating chamber, such that the isolator chip received in the chip accommodating hole and the magnetic ring accommodated in the magnetic ring accommodating chamber are separated from each other by the surrounding wall interposed between the isolator chip and the magnetic ring;
• and
• wherein the internal space of the surrounding wall that forms the chip accommodating hole comprises at least two positioning corners formed in the inner circumferential surface of the surrounding wall and angularly spaced from each other, wherein the at least two positioning corners respectively correspond to different corners of a shape of the isolator chip such that the isolator chip is positioned between the at least two spaced positioning corners of the internal space of the surrounding wall.