Co-packaging with silicon photonics hybrid planar lightwave circuit

An optoelectronic system comprising:

• a first photonic integrated circuit;
• a first electronic integrated circuit;
• and
• a dielectric substrate disposed between the first photonic integrated circuit and the first electronic integrated circuit, the dielectric substrate layered with a redistribution layer (RDL), wherein the dielectric substrate comprises silicon dioxide glass, wherein the dielectric substrate includes:
• a first optical waveguide disposed on the dielectric substrate to optically couple the first photonic integrated circuit disposed on one side of the dielectric substrate with at least one of a second photonic integrated circuit disposed on the one side of the dielectric substrate or an optical device disposed external to the dielectric substrate by guiding light in a direction parallel to a surface plane of an other side of the dielectric substrate, the other side being opposite the one side;
• a metal interconnect disposed through the dielectric substrate to electrically couple the first photonic integrated circuit disposed on the one side of the dielectric substrate with the first electronic integrated circuit disposed on the other side of the dielectric substrate;
• and
• a second optical waveguide disposed on the dielectric substrate to optically couple the first photonic integrated circuit with an external optical waveguide disposed external to the dielectric substrate.