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US 11,531,172 B2Granted
Wafer-level testing of lasers attached to photonics chips
AssigneeGlobalFoundries U.S. Inc.
InventorsZhuojie Wu, Bo Peng
Life of this patent
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Abstract
Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.
Claims18
A structure comprising:
- a first photonics chip including a first waveguide, a second waveguide, a third waveguide, a first optical tap coupling the second waveguide to the first waveguide, a second optical tap coupling the third waveguide to the first waveguide, a first photodetector coupled to the second waveguide, and a first grating coupler coupled to the third waveguide;
- and
- a first laser attached to the first photonics chip, the first laser configured to generate laser light directed by the first waveguide to the first optical tap and the second optical tap.
A structure comprising:
- a first photonics chip including a first waveguide, a second waveguide, a first optical tap coupling the second waveguide to the first waveguide, and a first photodetector coupled to the second waveguide;
- and
- a first laser attached to the first photonics chip, the first laser configured to generate laser light directed by the first waveguide to the first optical tap,
- wherein the first photonics chip includes an edge coupler coupling the first laser to the first waveguide and a modulator coupled to the first waveguide, and the first optical tap is coupled to the first waveguide at a first position between the edge coupler and the modulator.
1 more element
A method of testing a laser attached to a first photonics chip at a wafer level, the method comprising:
- ramping a first electrical current supplied to the laser such that an optical power of laser light that is output by the laser increases;
- directing a first portion of the laser light to a photodetector on the first photonics chip, wherein the first photonics chip and a second photonics chip are located on a substrate;
- measuring a second electrical current generated by the photodetector in response to the first portion of the laser light as a function of the first electrical current;
- and
- singulating the first photonics chip and the second photonics chip from the substrate.
2 more elements
Dependencies are inferred from the claim text.