Method for manufacturing laminated substrate, laminated substrate, and light emitting element substrate

A method for manufacturing a laminated substrate, the method comprising:

• removing a portion of a wiring layer not covered with a resist layer from a laminated substrate with an etchant to form a wiring,
• wherein the laminated substrate comprises:
• a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface;
• the wiring layer formed on an upper surface of the base layer;
• and
• the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and
• wherein the wiring is arranged at a position where the wiring is away from the eaves-shaped portion not to cover the eaves-shaped portion.

A method for manufacturing a laminated substrate, the method comprising:

• removing a portion of a wiring layer not covered with a resist layer from a laminated substrate with an etchant to form a wiring,
• wherein the laminated substrate comprises:
• a base layer including a mesa portion having a trapezoidal cross section, the mesa portion having a first inclined surface extending downward and outward from a top surface and a second inclined surface having an eaves-shaped portion protruding outward from the top surface;
• the wiring layer formed on an upper surface of the base layer;
• and
• the resist layer formed on an upper surface of the wiring layer and having a shape corresponding to a shape of the wiring, and
• wherein the wiring is arranged at a position where none of the wiring covers the eaves-shaped portion.