Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor device
AssigneeSumitomo Electric Industries, Ltd.
InventorsKeiji Wada, Tsutomu Hori, Taro Nishiguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeSumitomo Electric Industries, Ltd.
InventorsKeiji Wada, Tsutomu Hori, Taro Nishiguchi
Estimating the term…
A silicon carbide epitaxial substrate includes a silicon carbide single crystal substrate and a silicon carbide layer. In a direction parallel to a central region, a ratio of a standard deviation of a carrier concentration of the silicon carbide layer to an average value of the carrier concentration of the silicon carbide layer is less than 5%. The average value of the carrier concentration is more than or equal to 1×1014 cm−3 and less than or equal to 5×1016 cm−3. In the direction parallel to the central region, a ratio of a standard deviation of a thickness of the silicon carbide layer to an average value of the thickness of the silicon carbide layer is less than 5%. The central region has an arithmetic mean roughness (Sa) of less than or equal to 1 nm. The central region has a haze of less than or equal to 50.
A silicon carbide epitaxial substrate comprising:
Dependencies are inferred from the claim text.