Atomic layer deposition tool and method

A deposition system comprising:

• a deposition chamber;
• a first precursor supply configured to inject trimethylaluminum (Al(CH3)3) into the deposition chamber;
• a second precursor supply configured to inject water (H2O) into the deposition chamber;
• an exhaust system configured to transfer exhaust gases from the deposition chamber, the exhaust system comprising a plurality of pipe sections;
• and
• a solid coating of polytetrafluoroethene conformally covering the inner surfaces of at least one pipe section of the plurality of pipe sections, wherein the solid coating of polytetrafluoroethene extends continuously between opposite ends of the inner surfaces along the full length of the at least one pipe section, wherein the solid coating of polytetrafluoroethene has a thickness between 1 μm and 200 μm.

An atomic layer deposition (ALD) system comprising:

• a deposition chamber;
• a first precursor delivery system connected to the deposition chamber;
• a second precursor delivery system connected to the deposition chamber;
• and
• an exhaust line connected to the deposition chamber, wherein the exhaust line comprises one or more solid layers of polytetrafluoroethene extending conformally on an interior surface of the exhaust line, wherein the one or more solid layers of polytetrafluoroethene have a total thickness in the range of 30 μm to 200 μm.