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US 11,530,476 B2Granted
Device for sputtering
AssigneeApplied Nano Technology Science, Inc.
InventorsTien-Chun Cheng, Wen-Pin Lai, Hsin-Hsuan Huang, Yu-Ching Huang, Ta-Jung Su
Life of this patent
Estimating the term…
Abstract
The invention provides a device for sputtering comprising a main magnet, two secondary magnets mounted on two sides of the main magnet symmetrically, and a shell. The two secondary magnets face to each other in ends with the same polarity in a line. The shell is cylindrical and contains the main magnet and the secondary magnets.
Claims12
A device for sputtering, comprising:
- a main magnet;
- two secondary magnets mounted on two sides of the main magnet symmetrically, wherein the two secondary magnets face to each other with the same polarity facing each other in a line, and the two secondary magnets are arranged in a line crossing the main magnet;
- and
- a shell which is cylindrical and contains the main magnet and the secondary magnets,
- wherein a base of the main magnet is in a higher level than bases of the two secondary magnets.
2 more elements
A device for sputtering, comprising:
- a shell which is cylindrical;
- magnets inside the shell, wherein the magnets are mounted on two sides of a normal line of an inner surface of the shell symmetrically, and the magnets face to each other with the same polarity facing each other in a line, and
- a bar which is T-shaped and mounted along the normal line, wherein the bar has a wide end and a narrow end opposite the wide end, the wide end is positioned toward the inner surface of the shell, and the narrow end is positioned toward the center of the shell.
Dependencies are inferred from the claim text.