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US 11,530,466 B2Granted
Low thermal expansion alloy
AssigneeShinhokoku Material Corp.
InventorsNaoki Sakaguchi, Haruyasu Ohno
Life of this patent
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Abstract
A low thermal expansion alloy having a high rigidity and a low thermal expansion coefficient comprising, by mass %, C: 0.040% or less, Si: 0.25% or less, Mn: 0.15 to 0.50%, Cr: 8.50 to 10.0%, Ni: 0 to 5.00%, and Co: 43.0 to 56.0%, S: 0 to 0.050%, and Se: 0 to 0.050% and having a balance of Fe and unavoidable impurities, the contents of Ni, Co, and Mn represented by [Ni], [Co], and [Mn] satisfying 55.7≤2.2[Ni]+[Co]+1.7[Mn]≤56.7 and the structure being an austenite single phase.
Claims4
An alloy comprising, by mass %,
- C:
- 0.040% or less,
- Si:
- 0.25% or less,
- Mn:
- 0.15 to 0.50%,
- Cr:
- 8.50 to 10.0%,
- Ni:
- 0 to 5.00%,
- Co:
- 43.0 to 54.2%,
- S:
- 0 to 0.050%,
- Se:
- 0 to 0.050% and
- a balance of Fe and unavoidable impurities,
- contents of Ni, Co, and Mn represented by [Ni], [Co], and [Mn] satisfying
- 55.7≤2.2[Ni]+[Co]+1.7[Mn]≤56.7,
- a structure of the alloy being an austenite single phase,
- wherein
- the alloy has a thermal expansion coefficient of −1.0×10−6/° C. to +1.0×10−6/° C.
19 more elements
Dependencies are inferred from the claim text.