Method for dismantling adhesive structure
AssigneeLintec Corporation
InventorMasakazu Ishikawa
Life of this patent
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Abstract
The invention provides a method of dismantling an adhesion structure including a pair of adherends made of the same material or different materials and a dielectric adhesive sheet interposed between the pair of adherends and bonding the pair of adherends to each other. The method includes: a first step of heating the dielectric adhesive sheet by dielectric heating; and a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.
Claims10
A method of dismantling an adhesion structure comprising a pair of adherends that are made of the same material or different materials and a dielectric adhesive sheet that is interposed between the pair of adherends and bonds the pair of adherends to each other, the dielectric adhesive sheet comprising:
- a thermoplastic resin;
- and a dielectric filler having a mean particle size, which is a median diameter represented by D50, in a range from 1 μm to 30 μm, the mean particle size being measured in accordance with JIS Z 8819-2 (2001), the dielectric filler being a single one of, or a combination of two or more of compounds selected from, zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, and rutile-type titanium oxide,
- the method comprising:
- a first step of heating the dielectric adhesive sheet by dielectric heating;
- and
- a second step of applying an external force to at least one of the pair of adherends or the dielectric adhesive sheet to separate the pair of adherends from the dielectric adhesive sheet.
A method of dismantling an adhesion structure comprising a dielectric adhesive sheet, on a surface of which a sheet-shaped base material is laminated, and an adherend bonded to the dielectric adhesive sheet, the dielectric adhesive sheet comprising:
- a thermoplastic resin;
- and a dielectric filler having a mean particle size, which is a median diameter represented by D50, in a range from 1 μm to 30 μm, the mean particle size being measured in accordance with JIS Z 8819-2 (2001), the dielectric filler being a single one of, or a combination of two or more of compounds selected from, zinc oxide, silicon carbide (SiC), anatase-type titanium oxide, and rutile-type titanium oxide,
- the method comprising:
- a first step of heating the dielectric adhesive sheet by dielectric heating;
- and
- a second step of applying an external force to the dielectric adhesive sheet to separate the dielectric adhesive sheet from the adherend.
Dependencies are inferred from the claim text.