Method of making ohmic contact on low doped bulk silicon for optical alignment
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuei-Sung Chang, Chia-Hua Chu, Shang-Ying Tsai
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Abstract
Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) structure including an epitaxial layer overlying a MEMS substrate. The method includes bonding a MEMS substrate to a carrier substrate. The epitaxial layer is formed over the MEMS substrate, where the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts is formed over the epitaxial layer.
Claims20
A method for manufacturing a microelectromechanical systems (MEMS) structure, the method comprising:
- bonding a MEMS substrate to a carrier substrate;
- forming an epitaxial layer over the MEMS substrate, wherein the epitaxial layer has a higher doping concentration than the MEMS substrate;
- and
- forming a plurality of contacts over the epitaxial layer.
A method for manufacturing an integrated chip, the method comprising:
- forming a plurality of alignment marks over a first substrate;
- bonding the first substrate to a second substrate, thereby forming a cavity between the first and second substrates;
- forming an epitaxial layer over the second substrate;
- and
- forming a plurality of conductive structures over the epitaxial layer such that the conductive structures are aligned according to the plurality of alignment marks.
A method for manufacturing an integrated chip, the method comprising:
- bonding a first substrate to a second substrate, thereby sealing a cavity between the first and second substrate, wherein a plurality of alignment marks is disposed on the first substrate;
- performing a thinning process on the second substrate;
- forming an epitaxial layer on the second substrate;
- forming a plurality of conductive structures on the epitaxial layer, wherein the plurality of conductive structures is aligned according to the plurality of alignment marks;
- and
- performing an etching process on the second substrate and the epitaxial layer with the plurality of conductive structures in place, thereby forming a moveable element in the second substrate.
Dependencies are inferred from the claim text.