Manufacturing method of flexible electronic substrate and substrate structure
AssigneeBeijing BOE Technology Development Co., Ltd.
InventorCe Zhao
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Abstract
A manufacturing method of a flexible electronic substrate and a substrate structure are disclosed. The manufacturing method includes: providing a first substrate comprising a first surface and a second surface which are opposite; forming a separation layer on the first surface of the first substrate, the separation layer being in a film form; providing a second substrate on the separation layer, the second substrate being configured as a flexible substrate; and processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate.
Claims14
A manufacturing method of a flexible electronic substrate, comprising:
- providing a first substrate comprising a first surface and a second surface which are opposite;
- forming a separation layer on the first surface of the first substrate, wherein the separation layer is in a film form;
- providing a second substrate on the separation layer, wherein the second substrate is configured as a flexible substrate;
- and
- processing the separation layer, such that at least a part of the separation layer is cracked from the film form, thereby separating the second substrate from the first substrate,
- wherein the second substrate comprises a third surface and a fourth surface which are opposite, the third surface is closer to the first substrate, and
- the manufacturing method further comprises:
- manufacturing a first operation circuit on the fourth surface of the second substrate before processing the separation layer, and manufacturing a second operation circuit on the second surface of the first substrate before processing the separation layer.
Dependencies are inferred from the claim text.