Display panel and cutting method therefor, display device
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
InventorsXiaoping Wu, Chuan Li, Bo Wang
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Abstract
A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.
Claims7
A cutting method for a display panel, wherein the cutting method comprises:
- cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam;
- and
- severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads;
- wherein
- a cutting direction of the second laser beam is perpendicular to an extending direction of the leads;
- and
- a cutting depth of the second laser beam is greater than a thickness of the leads, and is less than a sum of the thickness of the leads and a thickness of a base film layer on which the conductive connectors and the leads are formed.
Dependencies are inferred from the claim text.