IR non-contact temperature sensing in a dispenser

A method of dispensing an assembly material on an electronic substrate, the method comprising:

• delivering an electronic substrate to a dispensing system including
• a frame,
• a pre-heat station coupled to the frame and configured to receive and heat the electronic substrate, the pre-heat station including a first non-contact sensor positioned to measure a temperature of the electronic substrate,
• a dispense station coupled to the frame, the dispense station including a dispensing unit gantry configured to move in x-axis and y-axis directions and at least one dispensing unit coupled to the dispensing unit gantry by a carriage configured to move the at least one dispensing unit in a z-axis direction, the at least one dispensing unit being configured to dispense material on the electronic substrate positioned on a substrate support, the dispense station further including a second non-contact sensor positioned above the electronic substrate on the dispense station, the second non-contact sensor being mounted on the carriage and directed toward the substrate to measure a temperature of the electronic substrate;
• moving the electronic substrate in a pre-dispense position within the pre-heat station;
• measuring a temperature of the electronic substrate in the pre-dispense position with the first non-contact sensor positioned above the electronic substrate;
• if the electronic substrate is at a proper temperature, moving the electronic substrate to a dispense position within the dispense station;
• dispensing viscous assembly material on the electronic substrate;
• and
• measuring a temperature of the electronic substrate in the dispense position with the second non-contact sensor positioned above the electronic substrate to ensure the electronic substrate is at a proper temperature.