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US 11,529,524 B2Granted
Encapsulated electronic circuit
OwnerTorsten Lehmann, Gregg Jørgen Suaning +4inventors
InventorsTorsten Lehmann, Gregg Jørgen Suaning, Tony Mikael Nygard, Thomas Guenther, William Lim, Kushal Das
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Abstract
A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.
Claims18
A device, comprising:
- an implantable housing configured to establish a hermetic volume therein, wherein the device is configured to enable hermeticity testing via active sensing of one or more phenomena in the hermetic volume;
- and
- a hermeticity sensor component at least one of internal or integral to the housing, wherein the hermeticity sensor component is configured to enable active sensing of the one or more phenomena, thereby enabling the hermeticity testing, wherein
- the hermeticity sensor component enables the evaluation of a physical phenomenon associated with at least one of an electrical capacitance or an electrical resistance of a structure exposed to the volume, and enables an output of a signal indicative of a change in the physical phenomenon, thereby indicating a change in a status of hermeticity of the volume, and
- the device includes a substrate at least one of in which or on which is located an interdigitized exposed pattern corresponding to the structure exposed to the volume.
2 more elements
A device, comprising:
- an implantable housing configured to establish a hermetic volume therein, wherein the device is configured to enable hermeticity testing via active sensing of one or more phenomena in the hermetic volume;
- and
- a palladium wire exposed to the hermetic volume, wherein the palladium wire is in electrical communication with a location on the housing exposed to an ambient environment of the housing.
A method, comprising:
- obtaining a substrate having vias extending therethrough from a first face of the substrate to a second face of the substrate opposite the first face;
- applying a first electrically conductive material onto the first face of the substrate over the vias;
- and
- inserting a second electrically conductive material into the vias, such that the second electrically conductive material extends to the second face of the substrate, wherein
- the second electrically conductive material is in electrical communication with the first electrically conductive material, and
- the method further comprises making an implantable housing configured to establish a hermetic volume therein wherein the implantable housing is part of a device configured to enable hermeticity testing via active sensing of one or more phenomena in the hermetic volume by attaching a component to the substrate, thereby establishing the implantable housing in a manner that the substrate corresponds to a wall of the implantable housing.
3 more elements
A device, comprising:
- an implantable housing configured to establish a hermetic volume therein, wherein the device is configured to enable hermeticity testing via active sensing of one or more phenomena in the hermetic volume, wherein
- the housing includes vias extending through a wall of the housing from a first face of the wall to a second face opposite the first face,
- a first electrically conductive material is located on the first face of the wall over the vias,
- a second electrically conductive material extends through the vias, such that the second electrically conductive material extends to the second face of the wall, and
- the second electrically conductive material is in electrical communication with the first electrically conductive material.
2 more elements
Dependencies are inferred from the claim text.