Ultrasonic device, ultrasonic module, and ultrasonic measuring apparatus

An ultrasonic module comprising:

• an ultrasonic device including a substrate provided with a first opening and a second opening, a support film that is provided on the substrate and blocks the first opening and the second opening, a transmitting piezoelectric film that is provided on the support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate, and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate;
• and
• a case that stores the ultrasonic device,
• wherein, in the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film, and
• wherein an opening width of the first opening is smaller than an opening width of the second opening.

An ultrasonic measuring apparatus comprising:

• an ultrasonic device including a substrate provided with a first opening and a second opening, a transmitting piezoelectric film that is provided on a support film at a position which overlaps the first opening when viewed in a thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate, and a receiving piezoelectric film that is provided on the support film at a position which overlaps the second opening when viewed in the thickness direction of the substrate and is interposed between a pair of electrodes in the thickness direction of the substrate;
• and
• a controller that controls the ultrasonic device,
• wherein, in the thickness direction of the substrate, a thickness dimension of the transmitting piezoelectric film is smaller than a thickness dimension of the receiving piezoelectric film, and
• wherein an opening width of the first opening is smaller than an opening width of the second opening.