Process for separating a plate into individual components
AssigneeOmmic
InventorPeter Michael Frijlink
Life of this patent
Estimating the term…
Abstract
Disclosed is a method for separating a plate into multiple individual detached components or cutting the plate into chips. The back end process for a plate includes providing a substrate; attaching the plate to the substrate using a sacrificial layer that is made of materials that in a solid state at ambient temperature and ambient pressure, and having a transformation temperature into one or more gaseous compounds at ambient pressure of between 80° C. and 600° C.; and separating the plate attached on the substrate into a plurality of plate portions; increasing temperature and/or reducing surrounding pressure to transform the sacrificial layer into one or more gaseous compounds.
Claims20
A process for back end processing of a plate in order to obtain a plurality of individual detached electrical, optical or optoelectronic components, comprising:
- a) providing a substrate;
- b) attaching the plate to the substrate by means of a sacrificial layer located between the plate and the substrate, the sacrificial layer being in contact with the plate and with the substrate, the sacrificial layer being made from at least one material that is in a solid state at ambient temperature and ambient pressure, the sacrificial layer having a transformation temperature into one or more gaseous compounds at ambient pressure of between 80° C. and 600° C.;
- c) separating the plate that is attached to the substrate into a plurality of plate portions that are attached to the substrate, the substrate remaining as a single piece;
- and
- d) increasing a temperature and/or reducing a surrounding pressure to a sufficiently high temperature and/or a sufficiently low pressure, respectively, such that the sacrificial layer attached to the plurality of plate portions is transformed into one or more gaseous compounds and the plurality of plate portions remain attached directly to the substrate.
Dependencies are inferred from the claim text.