Low insertion force connector assembly and semiconductor component test apparatus

A semiconductor component test apparatus comprising:

• a plate-shaped substrate 30 having a plurality of substrate fixing pin holes 30a formed thereon;
• a plurality of connection components 140 coupled to the substrate 30 by means of fixing pins 147 and coupling members 146 and having a plurality of contact pins 143 arranged in a plurality of rows;
• and
• a plurality of connectors 50 detachably coupled to the plurality of connection components 140 and having a plurality of contact pins 143 arranged in a plurality of rows,
• wherein each connection component 140 comprises connection component bodies 141 and the plurality of contact pins 143 arranged spaced apart from each other on the connection component bodies 141 in the plurality of rows, each connection component body 141 having a plurality of body fixing pin holes 1418 formed on the longitudinal direction, and the coupling members 146 and the plurality of connection components 140 are located on both sides of the substrate 30, while placing the substrate 30 therebetween, so that the connection components 140 are coupled to the substrate 30 by locking heads of the fixing pins 147 onto the plurality of body fixing pin holes 1418, allowing the fixing pins 147 to be passed sequentially through the plurality of body fixing pin holes 1418 and the substrate fixing pin holes 30a, and locking the end portions thereof onto pin locking portions of the coupling members 146.