Back to results
US 11,521,890 B2Granted
Apparatus for manufacturing semiconductor device
AssigneeKabushiki Kaisha Shinkawa
InventorShoji Wada
Life of this patent
Estimating the term…
Abstract
An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.
Claims8
An apparatus for manufacturing a semiconductor device, comprising:
- a base portion;
- a bonding stage arranged on the base portion and having a placement surface for placing a substrate;
- and
- one or more connecting members which connect the base portion and the bonding stage,
- wherein at least one of the one or more connecting members is a connecting plate which deflects following expansion and contraction of the bonding stage in a plane direction caused by a temperature change.
2 more elements
Dependencies are inferred from the claim text.