Cutting apparatus

A cutting apparatus that cuts a wafer, comprising:

• a cassette table on which a first cassette in which a frame unit, in which a wafer is positioned in an opening of a ring-shaped frame having the opening and the ring-shaped frame and the wafer are integrated by an adhesion tape, is housed and a second cassette in which a simple wafer is housed are selectively placed;
• a withdrawing unit selectively including a clamping part that clamps the ring-shaped frame and withdraws the frame unit from the first cassette when the first cassette is placed on the cassette table and a support part that supports the simple wafer and withdraws the simple wafer from the second cassette when the second cassette is placed on the cassette table;
• a first temporary putting unit on which the frame unit withdrawn by the clamping part of the withdrawing unit is temporarily put;
• a second temporary putting unit on which the simple wafer withdrawn by the support part of the withdrawing unit is temporarily put;
• a first conveying unit including a first frame holding part that holds the ring-shaped frame of the frame unit positioned at the first temporary putting unit and conveys the frame unit to a chuck table and a first wafer holding part that holds the simple wafer positioned at the second temporary putting unit and conveys the simple wafer to the chuck table;
• a cutting unit that cuts the wafer of the frame unit or the simple wafer held by the chuck table;
• a cleaning unit that holds and cleans the wafer of the frame unit or the simple wafer that has been cut;
• and
• a second conveying unit including a second frame holding part that holds the ring-shaped frame of the frame unit of the cut wafer and conveys the frame unit from the chuck table to the cleaning unit and a second wafer holding part that holds the cut simple wafer and conveys the simple wafer from the chuck table to the cleaning unit.