Probe head
AssigneeYokowo Co., Ltd.
InventorsYoshihiko Sakurai, Hiroshi Ishigure, Daisuke Hosokawa
Life of this patent
Estimating the term…
Abstract
Provided is a probe head capable of reducing an inductance value of a ground probe. In a probe head 1, a pin plate 40, a pin block 50, and a solder resist film 60 are stacked in this order from a measuring instrument side to be integrally formed, and constitute a support body that supports a signal probe 10 and a first ground probe 20. The pin plate 40 is an insulator. The pin block 50 is a conductor, and is electrically connected to the first ground probe 20 and a measuring instrument-side ground, and is not electrically connected to the signal probe 10. The solder resist film 60 is provided on the surface of the pin block 50 on a side of a device to be inspected, and is interposed between the pin block 50 and the device to be inspected.
Claims20
A probe head, comprising:
- a signal probe;
- a first ground probe;
- and
- a pin block through which the signal probe and the first ground probe penetrate, wherein at least a part of the pin block is electrically conductive, and the pin block is electrically connected to the first ground probe and is not electrically connected to the signal probe, and an insulation layer through which the signal probe and the first ground probe penetrate is provided on a surface of the pin block on a side of a device to be inspected, the insulation layer supporting the signal probe while not supporting the first ground probe,
- wherein the pin block includes a first through hole into which the signal probe is inserted, and a second through hole into which the first ground probe is inserted,
- wherein an inner diameter of the first through hole is larger than the inner diameter of a through hole of the insulation layer into which the signal probe is inserted, and
- wherein the inner diameter of the second through hole is smaller than the inner diameter of a through hole of the insulation layer into which the first ground probe is inserted.
A probe head, comprising:
- a signal probe,
- a first ground probe;
- and
- a pin block through which the signal probe and the first ground probe penetrate, wherein at least a part of the pin block is electrically conductive, and the pin block is electrically connected to the first ground probe and is not electrically connected to the signal probe, and an insulation layer through which the signal probe and the first ground probe penetrate is provided on a surface of the pin block on a side of a device to be inspected, the insulation layer supporting the signal probe while not supporting the first ground probe,
- wherein an inductance value between the pin block and a measuring instrument-side ground is lower than an inductance value of a portion of the first ground probe from a tip end thereof on the measuring instrument-side ground to a contact part between the first ground probe and the pin block.
A probe head, comprising:
- a signal probe;
- a first ground probe;
- and
- a pin block through which the signal probe and the first ground probe penetrate, wherein at least a part of the pin block is electrically conductive and is electrically connected to ground of a measuring instrument side, and the pin block is electrically connected to the first ground probe and is not electrically connected to the signal probe, and an insulation layer through which the signal probe and the first ground probe penetrate is provided on a surface of the pin block on a side of a device to be inspected,
- wherein the pin block includes a first through hole into which the signal probe is inserted, and a second through hole into which the first ground probe is inserted,
- wherein an inner diameter of the first through hole is larger than the inner diameter of a through hole of the insulation layer into which the signal probe is inserted, and
- wherein the inner diameter of the second through hole is smaller than the inner diameter of a through hole of the insulation layer into which the first ground probe is inserted.
A probe head, comprising:
- a signal probe;
- a first ground probe;
- and
- a pin block through which the signal probe and the first ground probe penetrate, wherein at least a part of the pin block is electrically conductive and is electrically connected to ground of a measuring instrument side, and the pin block is electrically connected to the first ground probe and is not electrically connected to the signal probe, and an insulation layer through which the signal probe and the first ground probe penetrate is provided on a surface of the pin block on a side of a device to be inspected,
- wherein an inductance value between the pin block and a measuring instrument-side ground is lower than an inductance value of a portion of the first ground probe from a tip end thereof on the measuring instrument-side ground to a contact part between the first ground probe and the pin block.
Dependencies are inferred from the claim text.