Back to results
US 11,518,876 B2Granted
Photosensitive resin composition and photosensitive dry film
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsYoichiro Ichioka, Kazunori Kondo
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.
Claims9
A photosensitive resin composition comprising
- (A) a resin having a phenolic hydroxyl group, and
- (B) an epoxy additive in the form of a compound containing 1 to 8 epoxy groups per molecule, containing at least one element selected from nitrogen, sulfur and phosphorus, and having a molecular weight of 50 to 6,000,
- the epoxy additive (B) being present in an amount of 0.1 to 18 parts by weight per 100 parts by weight of the resin (A),
- wherein the epoxy additive is a compound having the formula (9):
- XAm−XB (9)
- wherein m is an integer of 1 to 3, XA is a group selected from the group consisting of the following formulae:
- wherein, the broken line denotes a valence bond to XB, Ra to Re are each independently a C1-C6 monovalent hydrocarbon group, E1 and E2 are each independently a C1-C12 divalent hydrocarbon group, and the subscripts m1, m2 and m3 are each independently an integer of 0 to 3, j1 is an integer of 0 to 7, j2 is an integer of 1 to 8, and j3 is an integer of 1 to 3, and
- XB is a group selected from the group consisting of the following formulae:
5 more elements
Dependencies are inferred from the claim text.