Multi-layer functional film and production method thereof

A method of manufacture of an electronic device, said method comprising the steps of:

• (i) providing a composite film comprising a polymeric base layer having a first and second surface and disposed on the first surface thereof a first polymeric protective layer having a first surface and a second surface such that the first surface of said polymeric base layer is in contact with the first surface of the first polymeric protective layer, wherein said first polymeric protective layer comprises a first ethylene-based copolymer;
• (ii) removing said first polymeric protective layer from the first surface of said polymeric base layer;
• (iii) disposing on the exposed first surface of said polymeric base layer one or more functional layers to provide a multi-layer substrate, wherein the, or at least the uppermost, functional layer comprises zinc and/or tin in an amount of from about 5 wt % to about 80 wt % of said functional layer;
• (iv) disposing either said first polymeric protective layer comprising said first ethylene-based copolymer or a second polymeric protective layer comprising a second ethylene-based copolymer onto an exposed surface of the, or at least the uppermost, functional layer comprising zinc and/or tin to provide a multi-layer assembly;
• and
• (v) providing one or more conductive layer(s) and/or semiconductor layer(s) within or on said multi-layer assembly;
• wherein the second polymeric protective layer comprising the second ethylene-based copolymer has previously been removed from an analogous composite film in a manner analogous to that defined in step (ii).

A multi-layer assembly comprising:

• (i) a polymeric base layer having a first and second surface;
• (ii) one or more functional layers disposed on the first surface of said polymeric base layer, wherein the, or at least the uppermost, functional layer comprises zinc and/or tin in an amount of from about 5 wt % to about 80 wt % of said functional layer;
• and
• (iii) a polymeric protective layer comprising an ethylene-based copolymer disposed onto the surface of the, or at least the uppermost, functional layer comprising zinc and/or tin.

An electronic device comprising a multi-layer assembly comprising:

• (i) a polymeric base layer having a first and second surface;
• (ii) one or more functional layers disposed on the first surface of said polymeric base layer, wherein the, or at least the uppermost, functional layer comprises zinc and/or tin in an amount of from about 5 wt % to about 80 wt % of said functional layer;
• and
• (iii) a polymeric protective layer comprising an ethylene-based copolymer disposed onto the surface of the, or at least the uppermost, functional layer comprising zinc and/or tin;
• and wherein said electronic device further comprises:
• (iv) one or more conductive layer(s) and/or semiconductor layer(s) within or on said multi-layer assembly.