Back to results
US 11,518,066 B2Granted
Method of treating a solid layer bonded to a carrier substrate
AssigneeSiltectra GmbH
InventorsFranz Schilling, Wolfram Drescher, Jan Richter
Life of this patent
Estimating the term…
Abstract
A method for treating a solid layer includes: providing a multi-layer assembly having a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface including a defined surface structure, the defined surface structure resulting from a removal, which is effected by a crack, from a donor substrate, at least in sections; processing the solid layer, which is arranged on the carrier substrate; and separating the solid layer from the carrier substrate by a destruction of the bonding layer.
Claims16
A method, comprising:
- providing a multi-layer assembly comprising a carrier substrate and a solid layer bonded to the carrier substrate by a bonding layer, the solid layer having an exposed surface comprising a defined surface structure, the defined surface structure produced by a removal of the solid layer, which is effected by a crack, from a donor substrate having the crack, at least in sections of the solid layer;
- processing the solid layer, which is arranged on the carrier substrate;
- and
- after the processing, separating the solid layer from the carrier substrate by a destruction of the bonding layer.
1 more element
Dependencies are inferred from the claim text.