Protective film

A protective film for heat bending a resin substrate, comprising:

• a base material layer;
• and
• a pressure sensitive adhesive layer positioned on the base material layer and configured to be adhered to a resin substrate,
• wherein the pressure sensitive adhesive layer includes a polyolefin having a melting point of lower than 125° C. as a main material, the base material layer includes a laminate having a first layer positioned on a side opposite to the pressure sensitive adhesive layer and comprising a polyolefin having a melting point of 150° C. or higher as a main material, and a second layer positioned on a side facing the pressure sensitive adhesive layer and comprising an elastomer as an adhesive resin and a polyolefin having a melting point of 150° C. or higher as a non-adhesive resin, the elastomer in the second layer of the laminate in the base material layer includes a styrene-olefin-styrene block copolymer. and a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less when heating the protective film at 145° C. for 30 minutes in a state that the protective film is being interposed between two attaching substrates formed of polycarbonate and having a dimension of 30 cm in length×30 cm in width×2.0 mm in thickness, peeling off the attaching substrate on the side of the pressure sensitive adhesive layer under the conditions of a temperature of 25° C., a peeling angle of 90° and a pulling speed of 1,000 mm/min and viewing a surface of the attaching substrate in a plan view.