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US 11,505,455 B2Granted
Method for producing a micromechanical device having a damper structure
AssigneeRobert Bosch GmbH
InventorsHolger Hoefer, Klaus Offterdinger, Maximilian Amberger, Michael Stumber
Life of this patent
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Abstract
A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.
Claims10
A method for producing a micromechanical device having a damper structure, the method comprising:
- (A) providing a micromechanical wafer having a rear side;
- (B) applying a liquid damper material onto the rear side;
- (C) pressing a matrix against the rear side to form at least one damper structure in the damper material;
- (D) curing the damper material;
- and
- (E) removing the matrix;
- wherein prior to the step (B), liquid damper material is applied to the matrix, whereupon steps (B) and (C) are carried out simultaneously by placing and pressing the matrix against the rear side.
4 more elements
Dependencies are inferred from the claim text.