Vibration device

A vibration device comprising:

• a base including a semiconductor substrate having a first surface that is a front surface and a second surface that is a rear surface and a through electrode that passes through a portion between the first and second surfaces;
• and
• a vibrator fixed to the first surface via an electrically conductive joining member,
• wherein components below are placed at the second surface,
• an oscillation circuit that is electrically coupled to the vibrator via the through electrode and generates an oscillation signal by causing the vibrator to oscillate,
• a temperature sensor circuit,
• a temperature compensation circuit that performs temperature compensation on the oscillation signal based on an output from the temperature sensor circuit, and
• an output buffer circuit that outputs a clock signal based on the temperature compensated oscillation signal, and
• Dsx
• ⁢
• ⁢
• 1
• <
• Dbx
• ⁢
• ⁢
• 1
• ,
• a distance between the output buffer circuit and the through electrode is Dbx1, and a distance between the temperature sensor circuit and the through electrode is Dsx1.