Cost-efficient fingerprint sensor component and manufacturing method
AssigneeFingerprint Cards Anacatum IP AB
InventorOlivier Lignier
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of: providing a fingerprint sensor package having a sensing surface, a connection surface opposite the sensing surface, and sides connecting the sensing surface and the connection surface, the connection surface having connectors for allowing electrical connection of the fingerprint sensor component to the electronic device; arranging the fingerprint sensor package on a temporary carrier with the connection surface facing the temporary carrier; and adding material at least around the sides of the fingerprint sensor package, while leaving the connection surface of the fingerprint sensor package uncovered.
Claims13
A method of manufacturing a fingerprint sensor component having a component outline for integration into an electronic device, the method comprising the steps of:
- providing a fingerprint sensor package including:
- a fingerprint sensor integrated circuit (IC) covered by a protective coating having a sensing surface, and
- a package substrate having a die support side, supporting the fingerprint sensor IC, and an external connection side opposite the die support side, the external connection side of the package substrate providing a connection surface of the fingerprint sensor package having connectors for allowing electrical connection of the fingerprint sensor component to said electronic device;
- arranging said fingerprint sensor package on a temporary carrier with said connection surface facing said temporary carrier;
- and
- adding, while the fingerprint sensor package is arranged on the temporary carrier, material at least around sides of said fingerprint sensor package connecting the sensing surface and the connection surface of the fingerprint sensor package, while leaving the connection surface of said fingerprint sensor package uncovered.
A fingerprint sensor component having a component outline for integration into an electronic device, said fingerprint sensor component comprising:
- a fingerprint sensor package including:
- a fingerprint sensor integrated circuit (IC) covered by a protective coating having a sensing surface, and
- a package substrate having a die support side, supporting the fingerprint sensor IC, and an external connection side opposite the die support side, the external connection side of the package substrate providing a connection surface of the fingerprint sensor package having connectors for allowing electrical connection of the fingerprint sensor component to said electronic device, said fingerprint sensor package having a fingerprint sensor package outline, different from said component outline;
- and
- material added at least around the sides of said fingerprint sensor package, while leaving the connection surface of said fingerprint sensor package uncovered, said material defining the component outline of said fingerprint sensor component.
Dependencies are inferred from the claim text.