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US 11,492,337 B2Granted
Epoxy compound, resist composition, and pattern forming process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsMasayoshi Sagehashi, Ryosuke Taniguchi, Takeru Watanabe, Yoshinori Matsui
Life of this patent
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Abstract
An epoxy compound of formula (1) is provided. A resist composition comprising the epoxy compound is capable of adequately controlling the diffusion length of acid generated from an acid generator without sacrificing sensitivity.
Claims7
An epoxy compound having the formula (1):
- wherein X1 and X2 are each independently —CH2— or —O—, kA is 0 or 1, R1 and R2 are each independently a C4-C20 tertiary hydrocarbon group or a group selected from the following:
- wherein the broken line denotes a valence bond.
Dependencies are inferred from the claim text.