Microfabrication device, microfabrication method, transfer mold, and transfer object
AssigneeDexerials Corporation
InventorsKazuhiko Noda, Katsuhiro Doi, Asahiko Nogami, Kyoko Sakurai
Life of this patent
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Abstract
A new and improved microfabrication device, microfabrication method, transfer mold, and transfer object that can suppress a defect are provided. A microfabrication device comprises a tool mounting portion, a predetermined cutting tool, an oscillator, and a controller, wherein the controller performs a cutting process to satisfy at least one of: a cutting condition (1) that oscillations at a start point and an end point of each set are in phase with each other; and a cutting condition (2) that oscillations of the sets are in phase with each other.
Claims7
A microfabrication device comprising:
- a tool mounting portion;
- a cutting tool provided in the tool mounting portion, and configured to form fine concave portions on a substrate;
- a driving portion configured to move the tool mounting portion relative to the substrate;
- an oscillator provided in the tool mounting portion, and configured to oscillate the cutting tool in at least one of a depth direction and a surface direction of the substrate;
- and
- a controller configured to perform a plurality of sets of a cutting process of cutting the substrate while moving the tool mounting portion relative to the substrate and oscillating the cutting tool,
- wherein the controller is configured to perform the cutting process to satisfy both of:
- a cutting condition (1) that oscillations at a start point and an end point of each set are in phase with each other;
- and
- a cutting condition (2) that oscillations of the sets are in phase with each other, and
- wherein the cutting process includes a deep cutting process of repeatedly cutting a same part, with a cutting depth of a current set being deeper than a cutting depth of a previous set.
Dependencies are inferred from the claim text.