Back to results
US 11,488,760 B2Granted
Electronic component and method for manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorsKeita Muneuchi, Eiji Iso, Isao Ida, Kenichi Araki, Noriko Shimizu, Takashi Tomohiro
Life of this patent
Estimating the term…
Abstract
An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.
Claims13
An electronic component comprising:
- an element body made of a composite material of a resin material and metal powder, and
- a metal film is on the outer surface of the element body,
- wherein a plurality of particles of the metal powder of an outer surface of the element body are exposed from the resin material in an exposure region in which the metal powder is exposed from the resin material, the exposure region is a region in which the metal film and the element body make contact with each other, and the plurality of particles make contact with one another on the outer surface of the element body,
- a ratio of the metal powder the particles of which make contact with one another per unit cross-sectional area in the exposure region of the outer surface of the element body is larger than a ratio of the metal powder the particles of which make contact with one another per unit cross-sectional area in a region of the outer surface of the element body other than the exposure region, and
- the electronic component further comprises an insulating film that covers the region of the outer surface of the element body other than the exposure region.
2 more elements
An electronic component comprising:
- an element body made of a composite material of a resin material and metal powder, and
- a metal film is on the outer surface of the element body,
- wherein a plurality of particles of the metal powder of an outer surface of the element body are exposed from the resin material in an exposure region in which the metal powder is exposed from the resin material, the exposure region is a region in which the metal film and the element body make contact with each other, and the plurality of particles make contact with one another on the outer surface of the element body, and
- a ratio of those of the plurality of particles which have spherical shapes in the exposure region is lower than a ratio of those of the plurality of particles which have spherical shapes in a region of the outer surface of the element body other than the exposure region, and
- the electronic component further comprises an insulating film that covers the region of the outer surface of the element body other than the exposure region.
2 more elements
Dependencies are inferred from the claim text.