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US 11,486,042 B2Granted
Silicon coating on hard shields
AssigneeViavi Solutions Inc.
InventorsAdam Andrew Preuss, Richard A. Bradley, Jr., Georg J. Ockenfuss, Markus K. Tilsch, Andrew Clark, Marius Grigonis, Andy Shkabko, Nicolas Alexander Davis, Anthony Jay Kemp Cottrell
Life of this patent
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Abstract
A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.
Claims20
A device comprising:
- a metal substrate;
- a layer, on the metal substrate, of aluminum or copper;
- and
- a first silicon layer, on the layer of aluminum or copper, having a first thickness from 0.05 mm to 2 mm;
- and
- a second silicon layer, on the first silicon layer, having a second thickness from 10 nm to 100 nm.
3 more elements
A method of making a device, comprising:
- providing a metal substrate;
- applying on top of the metal substrate a layer of aluminum or copper using a twin wire arc spray process;
- and
- applying on top of the layer applied using the twin wire arc spray process a silicon layer having a first thickness of from 0.05 mm to 2 mm using a plasma spray process;
- and
- applying a second silicon layer on the first silicon layer, the second silicon layer having a second thickness of from 10 nm to 100 nm.
3 more elements
Dependencies are inferred from the claim text.