Additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting

An additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting, comprising:

• a vacuum forming chamber;
• a workbench, a forming area of the workbench being provided at least in the vacuum forming chamber;
• a powder supply device configured to spread powder on the forming a rea;
• at least one electron beam emitting, focusing and scanning device arranged at a top of the vacuum forming chamber and directly above the forming area and movable relative to the workbench, a scanning range of the electron beam device covering at least a part of the forming area and the electron beam device being able to generate a continuous electron beam and a pulsed electron beam;
• and
• a controller configured to control each electron beam device to operate to emit an electron beam in three modes:
• heating, selective melting and electron beam cutting, an acceleration voltage of the electron beam emitted by the electron beam device varying fully from 10 kV to 200 kV;
• wherein the workbench comprises:
• an operation platform, the forming area being provided in the operation platform;
• and a piston-type forming cylinder device disposed below the operation platform and comprising a forming cylinder and a piston-type elevating device;
• wherein an upper edge of the forming cylinder is flush with the operation platform, and the piston-type elevating device is able to move up and down in the forming cylinder;
• wherein the powder supply device comprises:
• a powder feeder configured to supply the powder to an upper surface of an operation platform;
• and
• a powder spread device provided on the operation platform and configured to disperse the powder into the forming cylinder and flatten the powder;
• wherein the electron beam device comprises:
• a casing provided outside the vacuum forming chamber;
• a filament configured to generate a n electron beam and provided in the casing;
• a cathode provided in the casing and linked to the filament;
• a grid electrode provided in the casing and located below the filament;
• an anode provided in the casing and located below the grid electrode;
• a focusing coil provided in the casing and located below the anode;
• and
• a pair of X/Y deflection coils provided in the casing and located below the focusing coil;
• wherein the powder supply device spreads the powder onto the forming area to form a powder bed with a certain thickness;
• wherein the electron beam device emits the electron beam in the heating mode, and the electron beam scans and preheats the powder bed so as to heat and slightly sinter the powder;
• wherein the electron beam device emits the electron beam in the selective melting mode, and the electron beam scans and melts the powder in a section so as to melt and deposit the powder to form a section layer of a required component;
• wherein the electron beam device emits the electron beam in the electron beam cutting mode, and the electron beam scans and cuts inner and outer outlines of a section of the component once or for a plurality of times to remove or cut off a rough edge and welded powder on the outlines so as to obtain precise and smooth inner and outer outlines of the section of the component;
• wherein the powder is spread on the section layer of the component with the cut section outlines, and the heating, melting deposition and outline cutting are carried out in sequence, manufacturing process of spreading, heating, melting deposition and outline cutting layer by layer is repeated until a required three-dimensional solid component is obtained;
• wherein in the heating mode, the electron beam emitted by the electron beam device focuses above or below a forming plane, a scanning speed is from 0.01 m/s to 50 m/s, two adjacent scanning paths do not overlap each other, and a scanning interval is greater than 10 microns;
• wherein in the selective melting mode, the electron beam emitted by the electron beam device focuses on a forming plane, a scanning speed is from 0.01 m/s to 10 m/s, two adjacent scanning paths do not overlap each other, and a scanning interval is greater than 10 microns, and the electron beam device regulates a melting depth by adjusting a beam intensity of the electron beam, a moving speed of a focus that is focused on the forming plane, the scanning interval of adjacent scanning paths, and an interval time of the adjacent scanning paths, for an area where the component entity is below a current forming layer and the current forming layer needs to fuse with the component entity, the melting depth exceeds a thickness of the current forming layer, and for another area where the powder bed or the cut edge of outline is below the current forming layer, the melting depth is equal to or less than the thickness of the current forming layer;
• and
• wherein in the electron beam cutting mode:
• the continuous electron beam emitted by the electron beam device is focused on a plane of the section of the component, a scannings peed is from 1 m/s to 50 m/s, and either two adjacent scanning paths overlap completely or a scanning interval is less than 8 microns;
• or
• the pulsed electron beam emitted by the electron beam device focuses on a plane of the section of component, a pulse frequency is 1 Hz to 100 kHz, a scanning speed is 0.1 m/s to 5 m/s, and either two adjacent scanning paths overlap each other or a scanning interval is less than 8 microns.