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US 11,484,925 B2Granted
Apparatus for cutting material and system for cutting material
AssigneePosco
InventorsHyeong-Jun Huh, Choong-Soo Lim, Sung-Joon Kwak
Life of this patent
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Abstract
The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.
Claims10
An apparatus for cutting a material comprising:
- a frame body installed on a conveying path of a material;
- a cutting means mounted on the frame body and configured to cut an end portion of the material being conveyed;
- a laser preheating means configured to preheat the material by irradiating a laser beam onto the material before the material is conveyed to the cutting means;
- and
- a blocking and reflection means, spaced from the laser preheating means, installed in front of a front surface of the cutting means and configured to block the laser beam reflected to the cutting means and to re-reflect the laser beam to the material.
2 more elements
Dependencies are inferred from the claim text.