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AssigneesCalifornia Institute of Technology, The Regents of the University of California
InventorsAdrian J. Tang, Mau-Chung Frank Chang, Rulin Huang
Estimating the term…
We have demonstrated that the bandwidth millimeter wavelengths offer can be leveraged to deeply spread a low-data rate signal below the thermal floor of the environment (sub-thermal) by lowered transmit power combined with free space losses, while still being successfully received through a novel dispreading structure which does not rely on pre-detection to extract timing information. The demonstrated data link ensures that it cannot be detected beyond a designed range from the transmitter, while still providing reliable communication. A demonstration chipset of this sub-thermal concept was implemented in a 28 nm CMOS technology and when combined with an InP receiver was shown to decode signals up to 30 dB below the thermal noise floor by spreading a 9600 bps signal over 1 GHz of RF bandwidth from 93 to 94 GHz using a 64 bit spreading code. The transmitter for this chipset consumed 62 mW while the receiver consumed 281 mw.
A receiver, comprising:
A method of communicating, comprising:
An integrated circuit, comprising:
Dependencies are inferred from the claim text.