Freezing a sacrificial material in forming a semiconductor
AssigneeMicron Technology, Inc.
InventorMatthew S. Thorum
Life of this patent
Estimating the term…
Abstract
The present disclosure includes apparatuses and methods related to freezing a sacrificial material in forming a semiconductor. In an example, a method may include solidifying, via freezing, a sacrificial material in an opening of a structure, wherein the sacrificial material has a freezing point below a boiling point of a solvent used in a wet clean operation and removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range.
Claims20
A method for forming a semiconductor device, comprising:
- performing a wet clean operation on a structure at a wet cleaning tool;
- displacing a solvent, used in the wet clean operation, in an opening of the structure with a sacrificial material at the wet cleaning tool;
- solidifying, via freezing, the sacrificial material in the opening of the structure at the wet cleaning tool;
- and
- removing the sacrificial material via sublimation by exposing the sacrificial material to a second particular temperature range at a deposition tool.
A method for forming a semiconductor device, comprising:
- forming a plurality of features in a structure at a dry etch tool;
- performing a wet clean operation on the structure using a solvent at a wet cleaning tool;
- displacing the solvent with a sacrificial material at the wet cleaning tool;
- solidifying, via freezing, the sacrificial material in openings of the plurality of features at the wet cleaning tool;
- and
- removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range at a deposition tool.
A method for forming a semiconductor device, comprising:
- performing a wet clean operation on a structure at a wet cleaning tool;
- displacing a solvent, used in the wet clean operation, in an opening of the structure with a sacrificial material at the wet cleaning tool;
- solidifying, via freezing, the sacrificial material in the opening of the structure at the wet cleaning tool;
- exposing the structure with the sacrificial material to oxygen after solidifying the sacrificial material and prior to removing the sacrificial material in response to moving the structure from the wet cleaning tool to a deposition tool;
- and
- removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range at the deposition tool.
Dependencies are inferred from the claim text.