Film forming composition containing fluorine-containing surfactant

A resist underlayer film-forming composition for use in a lithography process, the resist underlayer film-forming composition comprising a coating film resin, a surfactant containing a polymer having a C3-5 perfluoroalkyl partial structure and an oligomer having a C3-5 perfluoroalkyl partial structure, and a crosslinking agent, wherein the coating film resin is a novolac resin, a condensation epoxy resin, a (meth)acylic resin, a polyether-based resin, or a silicon-containing resin;

• wherein
• the surfactant is contained in an amount of 0.0001% by mass to 1.5% by mass based on the total solid content of the resist underlayer film-forming composition, and
• the resist underlayer film-forming composition is a film with a thickness of 0.01 μm to 3.0 μm, the film having reduced formation of an edge reservoir at a periphery of the film in which the edge reservoir causes an unnecessary residue that cannot be removed by an etching process relative a comparative underlayer film formed from the same components apart from the surfactant, which is a comparative surfactant that contains
• a polymer having a perfluoroalkyl partial structure, which is not a C3-5 perfluoroalkyl partial structure, and
• an oligomer having a perfluoroalkyl partial structure, which is not a C3-5 perfluoroalkyl partial structure.